Technology and Solution for thick Layered Electroless Copper Deposition

phone.: +375 (17) 226-47-03
StepanovaLI@bsu.by

Purpose:
The developed process allows the deposition of ductile soldering copper coatings with utilization of original electroless copper solution which includes specific complex of stabilizing-modifying agents
 


Region of application:
Instrument making, electronic engineering and microelectronics for:

  • forming of fine-measuring copper foil on substrate in process of continuous  or selective metallization
  • deposition if thick (up to 40 mm) copper coatings with high ductility
  • metallization of holes in printed circuits with removal of galvanic tightening
  • metallization of blind holes and holes with low and ultra-low diameter till their full filling with copper (for example for formation of sealing current conductors inside through holes in ceramic substrates)
  • deposition of the copper coatings instead silver coatings on functional ceramics and another substrates in the situation when another solutions don't allow to receive the uniform coatings

Technical parameters:

deposition rate, mm/h 2–7
temperature of solution, ° C 40–80
ductility (relative elongation up to breaking-off), % 11–16
electric conductivity and mechanical parameters comparable to metallurgical copper
the air leak (vacuum density) after completely filling of holes with copper, l mm merc. col  
no more than 10-7

Advantages:

  • high stability of solution (it may be boiled without decomposition)
  • the absence of dispersed copper phase in solution's volume
  • the absence of passivation of the groving copper surface
  • long time of solution's exploitation (up to 10 turnovers)
  • increase in labor productivity
  • high diffusing power of solution which allow to deposit copper up to full filling of any holes or hollows

 Implementation:

  • State company "Vityaz"(Vitebsk) – for metallization of holes in printed circuits with removal of galvanic tightenings
  • Research and manufacturing company "Saturn" (Kiev, Ukraine) – for formation of sealing current conductors inside through holes in ceramic substrates in production SHF integrated circuits
  • State Company "Elkerm" (Minsk) – for deposition of copper coatings on functional piezoceramics instead silver coatings with preserving of quality factor's parameters

 Options for collaboration:
You can purchase the technology know-how. We can manufacture small series of miniature articles with deposited copper coatings.